By using the Non Contact method of circuit boards, substrate damage is minimized, engineering efficiency is improved, and equipment with high value-added and high productivity can be achieved.
联系我们
Project | Dry film development | Solder proof development |
Substrate type | Encapsulated carrier board, HDI | |
Size | 403*508mm ~ 415*512mm, 508*608mm ~ 520*612mm | |
Passing capacity | 4200 pcs/day | |
thickness | Min 0.03mm(Cu 2/2) ~ Max 0.8mm | |
Hole size | BVH (min 50㎛) and PTH( Min 50㎛) | |
Line width | Min: 5-10㎛(Dry Film 15-20㎛) | |
Special Instructions | For high precision development engineering, two fluid development is added behind the normal development tank to reduce the development spray particles to 3~7um (conventional etching spray particles are 50~100um), further improving the development resolution. | |
Solder proof development process：
Input → Buffer # 1 → Developer # 1 → Developer # 2 → Developer # 3 → Developer new solution → Buffer # → Buffer # 3 → Hot water washing # 1, # 2, # 3, # 4 → Buffer # 4 Water washing # 1, # 2, # 3 → Buffer # 5 → Wind cutting → Hot air → Buffer # 6 → Discharge
Dry film development process：
Input → Buffer # 1 → Developing # 1 → Developing # 2 → Developing new solution → Buffer # → Buffer # 3 → Hot water washing # 1, # 2, # 3, # 4 → Buffer # 4 Water washing # 1, # 2, # 3 → Buffer # 5 → Air cutting → Hot air → Buffer # 6 → Discharge
