By using the non contact method of circuit boards, the water pool effect can be avoided to minimize substrate damage, improve engineering efficiency, and achieve high value-added and productive equipment for carrying boards.
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Project | Vertical etching |
Substrate type | Encapsulated carrier board, HDI |
Size | 403*508mm ~ 415*512mm, 508*608mm ~ 520*612mm |
Passing capacity | 4200 pcs/day |
Thickness | Min 0.03mm(Cu 2/2) ~ Max 0.8mm |
Hole size | BVH (min 50㎛) and PTH( Min 50㎛) |
Line width | Min: 5 ㎛ |
Special Instructions | For high precision etching engineering, two fluid etching is added after the normal etching groove to reduce the etching spray particles to 3~7um (the conventional etching spray particles are 50~100um), further improving the etching yield |
Vertical etching process：
Input → buffering → water washing → etching # 1 etching # 2 etching # 3 → two fluids (optional) → acid washing → water washing → blow drying → discharge → fixture reflux
