By using the Non Contact method of circuit boards, substrate damage is minimized, engineering efficiency is improved, and equipment with high value-added and high productivity can be achieved.
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Project | Stripping membrane |
Substrate type | Encapsulated carrier board, HDI |
Size | 403*508mm ~ 415*512mm, 508*608mm ~ 520*612mm |
Passing capacity | 4200 pcs/day |
Thickness | Min 0.03mm(Cu 2/2) ~ Max 0.8mm |
Hole size | BVH (min 50㎛) and PTH( Min 50㎛) |
Line width | Min: 5 ㎛ |
Special Instructions | No contact, gear transmission, polymer bearing fixed to maintain operation; Vibration type membrane filtration, capable of filtering a minimum of 0.8mm membrane residue |
Vertical film removal process:
Loading on the carrier plate → buffering → peeling film → new liquid → water washing → acid washing → water washing → blow drying → drying → unloading on the carrier plate → fixture reflux
