By using the Non Contact method of circuit boards, substrate damage is minimized, engineering efficiency is improved, and equipment with high value-added and high productivity can be achieved.
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Project | Dry film pre-treatment | Pre welding treatment |
Substrate type | Encapsulated carrier board, HDI | |
Size | 403*508mm ~ 415*512mm, 508*608mm ~ 520*612mm | |
Passing capacity | 4200 pcs/day | |
Thickness | Min 0.03mm(Cu 2/2) ~ Max 0.8mm | |
Hole size | BVH (min 50㎛) and PTH( Min 50㎛) | |
Line width | Min: 15 ㎛(Dry Film 30㎛) | |
Special Instructions | Non contact vertical pre-treatment M/C · 100% non-contact transportation without defects · Compared to the horizontal line, the production increases by 5% | |
Vertical pre-treatment process:
Input → degreasing → water washing → roughening → water washing → acid washing → water washing → blow drying → discharge → fixture reflux
